Copper has high electrical and thermal conductivity, excellent weldability, good plasticity and ductility, excellent cold working function and non-magnetic, and dispersed oxygen-free copper overcomes the shortcomings of low yield strength after annealing and creep resistance at high temperature, and has the characteristics of high temperature, high strength and high thermal conductivity, which has been highly valued by electronic data experts. At present, copper and its alloys have been widely used in the electronics industry, and in vacuum electronic devices, oxygen-free copper has ranked first among the seven structural materials in this field.
Oxygen content is one of the most important functions of oxygen-free copper. Because the amount of oxygen and copper is very small, the oxygen in oxygen-free copper exists in Cu2O mode in practice. At high temperatures, hydrogen disperses in copper at a great rate, encounters Cu2O and reduces it, producing a lot of water vapor. The amount of water vapor is proportional to the oxygen content of copper. For example, 0.01% oxygen containing copper, after annealing, in 100g copper will form 14cm of water vapor, the water vapor can not be dispersed by fine copper, so in the presence of Cu2O local, will produce thousands of mpa pressure, so that copper damage and produce brittleness and loss of vacuum fine. Therefore, it is necessary to strictly limit the oxygen content.
