C11500 copper wire is classified as an Oxygen Free High Conductivity (OFHC) copper alloy, which stands out for its excellent electrical properties, making it the material of choice for efficient electrical transmission applications. The oxygen-free composition of the alloy ensures low impurity levels, increasing conductivity by minimising electron scattering impurities. This property makes C11500 copper wire the material of choice for critical industries such as telecommunications, power distribution and electronics.
Its excellent ductility and extensibility make it easy to manufacture, allowing it to be seamlessly stretched into thin strands or moulded into a variety of shapes without compromising its electrical properties. In addition, C11500 has excellent corrosion resistance and maintains its integrity even in severe environments. The alloy’s compatibility with soldering and fusion bonding processes further enhances its utility in the assembly and connection of electrical components, making it widely adopted in a variety of applications.
| Melting Point – Liquidus°F | 1980 |
|---|---|
| Densitylb/cu in. at 68°F | 0.323 |
| Specific Gravity | 8.89 |
| Electrical Conductivity% IACS at 68°F | 100 |
| Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 224 |
| Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 9.8 |
| Specific Heat CapacityBtu/ lb /°F at 68°F | 0.092 |
| Modulus of Elasticity in Tensionksi | 17000 |
| Modulus of Rigidityksi | 6400 |
