Firstly, with its unique alloy ratio, C36000 copper foil enhances the mechanical properties of the material while maintaining the superior electrical and thermal conductivity of copper itself. This makes it an ideal choice for the manufacture of advanced circuit boards and battery electrode materials, capable of carrying higher current densities and providing more effective thermal management, contributing to the miniaturisation and high-efficiency development of electronic products.
Secondly, its corrosion resistance and processing adaptability should not be underestimated. C36000 copper foil’s excellent corrosion resistance ensures stable operation in harsh environments, such as humidity and high temperature, and prolongs the service life of the product. At the same time, good ductility and moderate strength characteristics to support diverse, high-precision processing, whether it is precision machining or complex moulding needs, can be easily dealt with, to meet the modern manufacturing industry for the material’s strict standards and diversified application needs.
Melting Point – Liquidus°F | 1650 |
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Melting Point – Solidus°F | 1630 |
Densitylb/cu in. at 68°F | 0.307 |
Specific Gravity | 8.5 |
Electrical Conductivity% IACS at 68°F | 26 |
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 67 |
Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 11.4 |
Specific Heat CapacityBtu/ lb /°F at 68°F | 0.09 |
Modulus of Elasticity in Tensionksi | 14000 |
Modulus of Rigidityksi | 5300 |