C44300 copper foil is a high-performance copper alloy foil, the main components of which include copper, tin and zinc, with excellent electrical conductivity and good mechanical properties. This copper foil is widely used in the electronics industry, especially in printed circuit boards (PCBs) and electromagnetic shielding materials, to provide stable electrical performance and reliable physical properties.
In addition, C44300 copper foil has excellent corrosion resistance and solderability, and is able to maintain good performance under a wide range of environmental conditions. Its thin, uniform thickness allows it to perform well in precision electronic equipment, effectively reducing signal transmission loss and improving circuit reliability and efficiency.
Melting Point – Liquidus°F | 1720 |
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Melting Point – Solidus°F | 1650 |
Densitylb/cu in. at 68°F | 0.308 |
Specific Gravity | 8.53 |
Electrical Conductivity% IACS at 68°F | 25 |
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 64 |
Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 11.2 |
Specific Heat CapacityBtu/ lb /°F at 68°F | 0.09 |
Modulus of Elasticity in Tensionksi | 16000 |
Modulus of Rigidityksi | 6000 |